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The technology is based on the difference of energy of hydrophilic and hydrophobic flat surface jointing and the method of hydrogen-inducing spalling inside a plate of hard material, preliminary saturated with hydrogen and hydrophilically connected to the substrate. The technology consists of:
- Methods of direct (without absorption water layer) hydrophilic jointing of solid components of the initial body and the substrate; methods with the use of physical (pressure and temperature) and chemical agents, being generated in the initial solid body with the help of coagulation of diluted hydrogen that results: (1) in the formation of internal surfaces inside a solid body, limiting vacuum or gaseous hydrogen-filled cavities that lie in the plane of coagulation;(2) in thermal or mechanochemical spalling along the plane of coagulation; and finally (3) in the transfer of fine (up to several microns) or ultra-fine (tens of nanometers) layer of the initial solid body to the substrate; (4) in the formation of multi-layer hetero-structures with random alterations of materials (metals, semi-conductors, dielectrics in any structural modification);(5) other.
- Designs and production technologies of devices and structures the above described technologies rely on, involved in a wide variety of industrial and consumer-sector applications.
As compared to the existing methods, capable of similar effects, the above described technology is characterized by high-stability, high potential of combining both materials and their thickness, is applicable to a wide variety of materials and instrumental hetero-structures for microelectromechanics, power integrated electronics, radio-, microwave and optoelectronics, nano-and microelectronics, and above all can be realized with the use of standard industrial equipment.
The technology has several applications, namely: (a) production of multi-level silicon structures on the insulator in order to create (super)large-scale integrated circuits with low energy consumption; (b) production of semi-conducting hetero-structures for laser, light-radiating and photo-converting devices, and also solar cells; (c) production of integrated circuits for power intelligent electronics; (d) production of multi-functional systems on the crystal with the in-built power and communication elements; and (e) other applications of the technology, e.g. biochips, are being developed at the moment.
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